1/10 june 2002 . STD12NF06L n-channel 60v - 0.08 w - 12a ipak/dpak stripfet? ii power mosfet n typical r ds (on) = 0.08 w n exceptional dv/dt capability n low gate charge n low threshold drive n through-hole ipak (to-251) power package in tube (suffix -1") n surface-mounting dpak (to-252) power package in tape & reel (suffix t4") description this power mosfet is the latest development of stmicroelectronis unique "single feature size?" strip- based process. the resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. applications n high current, high switching speed n solenoid and relay drivers n motor control, audio amplifiers n dc-dc & dc-ac converters n automotive environment type v dss r ds(on) i d STD12NF06L 60 v < 0.1 w 12 a 3 2 1 1 3 ipak to-251 (suffix -1) dpak to-252 (suffix t4) absolute maximum ratings ( ) pulse width limited by safe operating area. (1) i sd 12a, di/dt 200a/s, v dd =40v, t j t jmax (2) starting t j = 25 o c, i ar = 6a, v dd = 30v symbol parameter value unit v ds drain-source voltage (v gs = 0) 60 v v dgr drain-gate voltage (r gs = 20 k w ) 60 v v gs gate- source voltage 16 v i d drain current (continuous) at t c = 25c 12 a i d drain current (continuous) at t c = 100c 8.5 a i dm ( ) drain current (pulsed) 48 a p tot total dissipation at t c = 25c 30 w derating factor 0.2 w/c dv/dt (1) peak diode recovery voltage slope 15 v/ns e as (2) single pulse avalanche energy 100 mj t stg storage temperature -55 to 175 c t j operating junction temperature internal schematic diagram
STD12NF06L 2/10 thermal data electrical characteristics (t case = 25 c unless otherwise specified) off on (* ) dynamic rthj-case rthj-amb t l thermal resistance junction-case thermal resistance junction-ambient maximum lead temperature for soldering purpose max max typ 5 100 275 c/w c/w c symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 60 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating t c = 100c 1 10 a a i gss gate-body leakage current (v ds = 0) v gs = 16 v 100 na symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs i d = 250 a 1 2.5 v r ds(on) static drain-source on resistance v gs = 10 v i d = 6 a v gs = 5 v i d = 6 a 0.08 0.10 0.10 0.12 w w symbol parameter test conditions min. typ. max. unit g fs (*) forward transconductance v ds =25 v i d =6 a 7s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25v, f = 1 mhz, v gs = 0 350 75 30 pf pf pf
3/10 STD12NF06L switching on switching off source drain diode (*) pulsed: pulse duration = 300 s, duty cycle 1.5 %. ( ) pulse width limited by safe operating area. symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on delay time rise time v dd = 30 v i d = 6 a r g = 4.7 w v gs = 4.5 v (resistive load, figure 3) 10 35 ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 48 v i d = 12 a v gs = 5v 7.5 2.5 3.0 10 nc nc nc symbol parameter test conditions min. typ. max. unit t d(off) t f turn-off delay time fall time v dd = 30 v i d = 6 a r g = 4.7 w v gs = 4.5 v (resistive load, figure 3) 20 13 ns ns symbol parameter test conditions min. typ. max. unit i sd i sdm ( ) source-drain current source-drain current (pulsed) 12 48 a a v sd (*) forward on voltage i sd = 12 a v gs = 0 1.5 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 12 a di/dt = 100a/s v dd = 16 v t j = 150c (see test circuit, figure 5) 50 67 2.5 ns nc a electrical characteristics (continued) safe operating area thermal impedance
STD12NF06L 4/10 output characteristics transfer characteristics transconductance static drain-source on resistance gate charge vs gate-source voltage capacitance variations
5/10 STD12NF06L normalized gate threshold voltage vs temperature normalized on resistance vs temperature source-drain diode forward characteristics . . .
STD12NF06L 6/10 fig. 1: unclamped inductive load test circuit fig. 1: unclamped inductive load test circuit fig. 2: unclamped inductive waveform fig. 3: switching times test circuits for resistive load fig. 4: gate charge test circuit fig. 5: test circuit for inductive load switching and diode recovery times
7/10 STD12NF06L dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a3 0.7 1.3 0.027 0.051 b 0.64 0.9 0.025 0.031 b2 5.2 5.4 0.204 0.212 b3 0.85 0.033 b5 0.3 0.012 b6 0.95 0.037 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 15.9 16.3 0.626 0.641 l 9 9.4 0.354 0.370 l1 0.8 1.2 0.031 0.047 l2 0.8 1 0.031 0.039 a c2 c a3 h a1 d l l2 l1 1 3 = = b3 b b6 b2 e g = = = = b5 2 to-251 (ipak) mechanical data 0068771-e
STD12NF06L 8/10 dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b2 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l2 0.8 0.031 l4 0.6 1 0.023 0.039 == d l2 l4 1 3 == b e == b2 g 2 a c2 c h a1 detail "a" a2 detail "a" to-252 (dpak) mechanical data 0068772-b
9/10 STD12NF06L tape and reel shipment (suffix t4)* tube shipment (no suffix)* dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters all dimensions are in millimeters *on sales type
STD12NF06L 10/10 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is registered trademark of stmicroelectronics a 2002 stmicroelectronics - all rights reserved all other names are the property of their respective owners. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malt a - morocco - singapore - spain - sweden - switzerland - united kingdom - united states. http://www.st.com
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